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殷志富
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( 副教授 )
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的个人主页 https://teachers.jlu.edu.cn/ZhifuYin/zh_CN/index.htm
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副教授
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性别 :
男
毕业院校 :
大连理工大学
学历 :
博士研究生毕业
学位 :
博士
在职信息 :
在职
所在单位 :
机械与航空航天工程学院
学科 :
机械制造及其自动化
办公地点 :
吉林省长春市人民大街5988号吉林大学南岭校区机械馆702
论文成果
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论文成果
[1] Qu Xingtian,Jinlai Li, Zhifu Yin*,Residual stress release for SU-8 structures by water assist ultrasonic,Microsystem Technologies
[2] Zhifu Yin*,Helin Zou,A fast and simple bonding method for low cost microfluidic chip fabrication,Journal of Electrical Engineering- Elektrotechnicky Casopis
[3] Xingtian Qu,Jinlai Li,Zhifu Yin*,A novel bonding method for large scale PMMA micro- and nanofluidic devices,Japanese Journal of Applied Physics
[4] Zhifu Yin*,Helin Zou,Multilayer patterning technique for micro- and nanofluidic chip fabrication,2018,21(12),174
[5] Zhifu Yin*,E Cheng,Helin Zou,Fast microfluidic chip fabrication technique by laser erosion and sticky tape assist bonding technique,Journal of Nanoscience and Nanotechnology,2018,18(6)4082-4086
[6] Zhifu Yin*,Bolin Lu,Helin Zou,A novel SU-8 nanofluidic chip fabrication technique by traditional UV photolithography,Microsystem Technologies,2017,23(12),5613-5619
[7] Zhifu Yin*,Helin Zou,Lei Sun,PC nanofluidic chip fabrication technique by hot embossing and thermal bonding,Journal of Nanoscience and Nanotechnology,2018,18(4),2530-2535
[8] Zhifu Yin*,E Cheng,Helin Zou,Numerical study on the shrinkage behavior of SU-8 patterns,Microsystem Technologies,2017,23(10),4957-4964
[9] Zhifu Yin*,Bolin Lu,E Cheng,Helin Zou,Fabrication of bottom fillet nano-mold to increase the mold lifetime,Journal of Nanoscience and Nanotechnology,2017,17(12),8975–8980,
[10] Zhifu Yin*,Helin Zou,Experimental and numerical study on PDMS collapse for fabrication of micro/nanochannels,Journal of Electrical Engineering- Elektrotechnicky Casopis,2017,67(6):414~420
[11] Zhifu Yin,E Cheng,Helin Zou*,To optimize nano hot embossing, consider unique traits,Society of PLASTICS ENGINEERS,2014
[12] Zhifu Yin,Lei Sun,E Cheng,Helin Zou*,Numerical study on the de-molding behavior of 2D PMMA nanochannles during hot embossing process,Microsystem Technologies,2016,22(1):129~135
[13] Zhifu Yin,Lei Sun,Helin Zou*,Shenbo Xu,Optimization of the profile of the nano-mold and the imprinting conditions by numerical simulation method,Microsystem Technologies,2016,22(5):1105~1113
[14] Zhifu Yin,Lei Sun,Helin Zou*,An innovative low-cost photomask fabrication technique,Journal of Nanoscience and Nanotechnology,2016,16(9):9751-9755
[15] Zhifu Yin,Lei Sun,Helin Zou*,Shenbo Xu,Bonding of 1D PMMA nanofluidic chip with low dimension loss and high bonding strength,Journal of Nanoscience and Nanotechnology,2016,16(8):8439-8444
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