殷志富论文成果 Zhifu Yin*，Helin Zou，A fast and simple bonding method for low cost microfluidic chip fabrication，Journal of Electrical Engineering- Elektrotechnicky Casopis

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Zhifu Yin*，Helin Zou，A fast and simple bonding method for low cost microfluidic chip fabrication，Journal of Electrical Engineering- Elektrotechnicky Casopis

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上一条： Qu Xingtian，Jinlai Li, Zhifu Yin*，Residual stress release for SU-8 structures by water assist ultrasonic，Microsystem Technologies

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