Personal Information
Associate Professor
Paper Publications
- [1]Qu Xingtian，Jinlai Li, Zhifu Yin*，Residual stress release for SU-8 structures by water assist ultrasonic，Microsystem Technologies
- [2]Zhifu Yin*，Helin Zou，A fast and simple bonding method for low cost microfluidic chip fabrication，Journal of Electrical Engineering- Elektrotechnicky Casopis
- [3]Xingtian Qu，Jinlai Li，Zhifu Yin*，A novel bonding method for large scale PMMA micro- and nanofluidic devices，Japanese Journal of Applied Physics
- [4]Zhifu Yin*，Helin Zou，Multilayer patterning technique for micro- and nanofluidic chip fabrication，2018，21（12），174
- [5]Zhifu Yin*，E Cheng，Helin Zou，Fast microfluidic chip fabrication technique by laser erosion and sticky tape assist bonding technique，Journal of Nanoscience and Nanotechnology，2018，18（6）4082-4086
- [6]Zhifu Yin*，Bolin Lu，Helin Zou，A novel SU-8 nanofluidic chip fabrication technique by traditional UV photolithography，Microsystem Technologies，2017，23（12），5613-5619
- [7]Zhifu Yin*，Helin Zou，Lei Sun，PC nanofluidic chip fabrication technique by hot embossing and thermal bonding，Journal of Nanoscience and Nanotechnology，2018，18（4），2530-2535
- [8]Zhifu Yin*，E Cheng，Helin Zou，Numerical study on the shrinkage behavior of SU-8 patterns，Microsystem Technologies，2017，23（10），4957-4964
- [9]Zhifu Yin*，Bolin Lu，E Cheng，Helin Zou，Fabrication of bottom fillet nano-mold to increase the mold lifetime，Journal of Nanoscience and Nanotechnology，2017，17（12），8975–8980,
- [10]Zhifu Yin*，Helin Zou，Experimental and numerical study on PDMS collapse for fabrication of micro/nanochannels，Journal of Electrical Engineering- Elektrotechnicky Casopis，2017，67（6）：414~420