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Yin Zhifu
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Associate Professor
Paper Publications
[11]Zhifu Yin,E Cheng,Helin Zou*,To optimize nano hot embossing, consider unique traits,Society of PLASTICS ENGINEERS,2014
[12]Zhifu Yin,Lei Sun,E Cheng,Helin Zou*,Numerical study on the de-molding behavior of 2D PMMA nanochannles during hot embossing process,Microsystem Technologies,2016,22(1):129~135
[13]Zhifu Yin,Lei Sun,Helin Zou*,Shenbo Xu,Optimization of the profile of the nano-mold and the imprinting conditions by numerical simulation method,Microsystem Technologies,2016,22(5):1105~1113
[14]Zhifu Yin,Lei Sun,Helin Zou*,An innovative low-cost photomask fabrication technique,Journal of Nanoscience and Nanotechnology,2016,16(9):9751-9755
[15]Zhifu Yin,Lei Sun,Helin Zou*,Shenbo Xu,Bonding of 1D PMMA nanofluidic chip with low dimension loss and high bonding strength,Journal of Nanoscience and Nanotechnology,2016,16(8):8439-8444
[16]Zhifu Yin,Lei Sun,Helin Zou*,Numerical Analysis on PET Demolding Stage in Thermal Nanoimprinting Lithography,Microsystem Technologies,2017,23(4):899-905
[17]Zhifu Yin,Liping Qi,Helin Zou*,Lei Sun,Shenbo Xu,The low auto-fluorescence fabrication methods for plastic nanoslits,IET nanobiotechnology,2016,10(2):75~80
[18]Zhifu Yin,E Cheng,Helin Zou*,Analysis of polymer viscoelastic properties based on compressive creep tests during hot embossing for two-dimensional polyethylene terephthalate nanochannels,Polymer Engineering & Science,2014,54(10):2398~2406
[19]Zhifu Yin,Liping Qi,Helin Zou*,Lei Sun,Shenbo Xu,A novel bonding method for fabrication of PET planar nanofluidic chip with low dimension loss and high bonding strength,Journal of Micromechanics and Microengineering,2015,25:085015~085015
[20]Zhifu Yin,E Cheng,Helin Zou*,Li Chen,Fabrication of two dimensional PET nanofluidic chip using hot embossing and thermal bonding technique,Biomicrofluidics,2014,8(6):066503~066503
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