张明喆

Professor

Gender:Male

Education Level:Doctor graduate

Paper Publications

Current position: Home > Scientific Research > Paper Publications

9. C. Liu, B. B. Yao, S. M. Wang, H. F. Tian and M. Z. Zhang*, Fabrication of the Pattern of Copper Nanowires with Adjustable Density on Oxidized Si Substrate, J. Phys. Chem. C 2009, 113, 21303 .2018
8. S. M. Wang, C. Wang, M. Z. Zhang*, Z. C. Zong, H. F. Tian, C. Liu, J. Cao and G. T. Zou，Electrode position and Characterization of Quasi-One-Dimensional Lead/Lead Selenide Heterostructure Ordered Arrays, J. Phys. Chem. C 2009, 113, 16337.2018
7. K. Wang, L. P. Niu, Z. C. Zong, M. Z. Zhang*, C. Wang, X. J. Shi, Y. F. Men, and G. T. Zou, Direct Electrodeposition of Copper Ladder Structures on Silicon Substrate, Crystal Growth & Design 2008, 8, 442.2018
6. Z. C. Zong, H. Yu, L. P. Nui, M. Z. Zhang*, C. W. Wang, W. Li, Y. F. Men, B. B. Yao, and G. T. Zou, Potential-induced copper periodic micro-/nanostructures by electrodeposition on silicon substrate，Nanotechnology 2008,19, 315302.2018
5. M. Z. Zhang, G. H. Zuo, Z. C Zong, H. Y. Chen, Z. He, C. M. Yang, and G. T. Zou, Self-Assembly of Copper Micro/nano-size Parallel Wires by Electrodeposition on Silicon Substrate, Small 2006, 2, 727.2018
4. M. Z. Zhang, G. H. Zuo, Z. C Zong, H. Y. Chen, Z. He, C. M Yang, D. M. Li, and G. T. Zou, Self-Assembly from the Branch Pattern to Parallel Wire Array in Electrodeposition, Appl. Phys. Lett. 2006, 88, 203106.2018
3. M. Z. Zhang, Y. Wang, S. Wang, G. W. Yu, M. Wang, R. W. Peng, and N. B. Ming, Formation of Copper Electrodeposits on an Untreated Insulating Substrate, J. Phys.- Condens. Mat. 2004, 16, 695.2018
2. M. Z. Zhang, M. Wang, Z. Zhang, J. M. Zhu, R. W. Peng, and N. B. Ming, Periodic Structures of Randomly Distributed of Cu/Cu2O Nanograins and Periodic Cell Voltage in Copper Electrodeposition, Electrochim. Acta 2004, 49, 2379.2018
1. M. Z. Zhang, S. Lenhert, M. Wang, L. F. Chi, H. Fuchs, and N. B. Ming, Two-Dimensional Regular Arrays of Copper Wires Formed by Patterned Electrodeposition, Adv. Mater. 2004, 16, 409 .2018

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