王东方 Paper Publications 7. The 23rd Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2021, August 25 - August 27, On-line, France)

Dong F Wang

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博士

Doctor graduate

Zhejiang Uni. & Tohoku Uni.

Recommended Ph.D.Supervisor

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Business Address:Room 703, Shao Yifu Mechanical & Material Building, Nanling Campus, Jilin University

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7. The 23rd Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2021, August 25 - August 27, On-line, France)

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Pre One:6. Synchronous Identification and Successive Detection of Multiple Traces with Tunable Coupling Oscillators Elsevier Mechanical Systems and Signal Processing (Volume: 166) (IF=6.823), Accepted 23 August 2021, Available online 04 September, 2021, 166 (2021) 108395, https://doi.org/10.1016/j.ymssp.2021.108395 (13pp) Cao Xia, #Dong F. Wang*, Jie Song, Takahito Ono, Toshihiro Itoh, Ryutaro Maeda, Masayoshi Esashi

Next One:7a. Developing MEMS Electric Current Sensors for End-use Monitoring of DC Power Supply: Part X – An IEEE802.11g Protocol Compliant Integratable Dual-frequency Coaxial Microstrip Antenna (Oral) Proceedings of the 23rd Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Date Added to IEEE Xplore: 25 Oct. 2021, DOI: 10.1109/DTIP54218.2021.9568682 (6pp) Liqiang FAN, #Dong F. WANG*, Toshihiro ITOH, Zhongpeng YU, Ryutaro MAEDA