王东方 Paper Publications 5. The 26th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2024, June 2-June 5, Dresden, Germany)

Dong F Wang

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博士

Doctor graduate

Zhejiang Uni. & Tohoku Uni.

Recommended Ph.D.Supervisor

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5. The 26th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2024, June 2-June 5, Dresden, Germany)

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Pre One:4. Temperature sensing and energy harvesting with a MEMS parametric coupling device under Low frequency vibrations Elsevier Journal of Sound and Vibration (Volume: 585) (IF=4.7), Accepted 16 April 2024, Available online 18 April 2024, Version of Record 4 May, 2024, https://doi.org/10.1016/j.jsv.2024.118456 (20pp) Jie Song, Cao Xia, Guansong Shan, Zhuqing Wang, Takahito Ono, Guanggui Cheng, #Dong F. Wang*

Next One:5a. Oscillation in Coupled Resonator Systems: Part VI – Study on Internal Resonance Sensing from Single Trace to Multiple Traces with High Sensitivity (Short Oral with Poster) Proceedings of the 26th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 001-004, 979-8-3503-7826-9/24 (4pp: 1-4) Shaokang Chen, Puyuan Cong, #Dong F. Wang*, Takahito Ono, Toshihiro Itoh