2018 The 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2018, May 22-May 25, Roma, Italy), Localization in Coupled Systems: Part III – Vibration Characteristics Analysis in A Mode-localized Four Cantilever Array with and without Mass Perturbation, Proceedings of the 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 186-190, 978-1-5386-6197-0/18 (5pp) Jing Hong, Xiaodong Li, Di Zhou, Shuyi Liu, Xin Liu*, #Dong F. Wang**
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Pre One:2018 The 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2018, May 22-May 25, Roma, Italy), Oscillation in Coupled Resonators Systems: Part IV – Study on 1:3 Internal Resonance Applicable to Sensor Devices of High Sensitivity, Proceedings of the 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 141-144, 978-1-5386-6197-0/18 (4pp) Guowen Zheng, Xu Du, Cao Xia, Shenglai Wan, Xin Wang*, #Dong F. Wang**
Next One:2018 The 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2018, May 22-May 25, Roma, Italy), Developing Self-powered High Performance Sensors: Part I – A Tri-axial Piezoelectric Accelerometer with An Error Compensation Method Proceedings of the 20th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 229-232, 978-1-5386-6197-0/18 (4pp) Yifan Zhu, #Dong F. Wang*, Yupeng Fu, Xu Yang**
