2017 Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part VI – Corresponding Relationship between Sensitivity and Magnetic Induction Proceedings of the 19th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 83-86, 978-1-5386-2950-5/17 (4pp) Xuesong Shang, Yang Li, Huan Liu, Takeshi Kobayashi, #Dong F. Wang*, Toshihiro Itoh, Ryutaro Maeda
Hits:
Pre One:2017 The 19th IEEE International Conference on Solid-State Sensors, Actuators and Microsystem (IEEE TRANSDUCERS 2017, June 18-22, Kaohsiung, Taiwan), MODE-LOCALIZED TRIO CANTILEVER ARRAY FOR PICOGRAM ORDER MASS SENSING (No.0320, accepted for Poster Presentation), Proceedings of 19th IEEE International Conference on Solid-State Sensors, Actuators and Microsystem, 1449-1452, 978-1-5386-2732-7/17 Di Zhou, Xiaodong Li, Jiajun He, Xin Liu, #Dong F. Wang*
Next One:2017 The 19th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2017, May 29-June 1, Bordeaux, France), Localization in Coupled Systems: Part II – Consideration on Damping Issue in A Mode-localized Cantilever Array, Proceedings of the 19th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 229-232, 978-1-5386-2950-5/17 (4pp) Xiaodong Li, Di Zhou, Rui Liu, Shuyi Liu, Xin Liu, #Dong F. Wang*
