王东方 Paper Publications 2. The 25th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2023, May 28th - May 31st, Valletta, Malta)

Dong F Wang

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博士

Doctor graduate

Zhejiang Uni. & Tohoku Uni.

Recommended Ph.D.Supervisor

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2. The 25th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (IEEE DTIP 2023, May 28th - May 31st, Valletta, Malta)

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Pre One:1. A Passive Sensing - Wireless Transmitting Scheme Demonstrated by Integrating A Magnetic Cantilever with A Microstrip Patch for DC Current Monitoring IEEE Transactions on Instrumentation and Measurement (Volume: 72) (IF=5.6), Accepted 09 April 2023, Published to IEEE Xplore® 27 April 2023, Article DOI: 10.1109/TIM.2023.3270976 (9pp) #Dong F. Wang*, Yifan Fang, Zhehao Gu, Yiyi He, Toshihiro Itoh

Next One:2a. Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XII – Thermoelastic Damping for Structural Optimization Applicable to Resonant Galvanometers (Poster) Proceedings of the 25th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, Date Added to IEEE Xplore: 28 August. 2023, DOI: 10.1109/DTIP54218.2023.9568682, Page(s): 01-05 Yifan FAN, Hongxiang HAN, #Dong F. WANG*, Takahito ONO, Toshihiro ITOH